Significant reduction in footprint and purchase costs, increased throughput, and substantial improvement in substrate quality.
■Suitable for various WET processes such as etching, RCA cleaning, and developing
■Ideal for organic stripping/lift-off processes that do not use ultrasound
◎Compatible with high-pressure jet and spray treatments
◎When using ultrasound for effective removal of dry-etch residues and burrs during lift-off, the "Spin Dip Processor" is recommended.
■Full process of chemical solution ⇒ rinse ⇒ drying in a single chamber, supporting Dry-In/Dry-Out
◎Conventional method: 2-chamber configuration (substrate remains in a chemical solution during transfer between chambers)
◎New method: UDS type uses a 1-chamber configuration.
■Basic operation of the substrate
◎ "Upper section... LD of the substrate" ⇒ "Lower section... chemical treatment" ⇒
⇒ "Middle section... rinse and dry" ⇒ "Upper section... ULD of the substrate"
■The patented isolation plate ensures the concentration of the chemical solution during reuse.
◎Since there is no dilution from rinse water contamination, the chemical solution can be temperature-controlled and reused.
*For more details, please refer to the PDF document or feel free to contact us.
Wafer, batch-type cleaning equipment, substrate cleaning equipment, spin cleaning equipment, semiconductor manufacturing equipment, resist stripping equipment, resist coating equipment, cleaning equipment, megasonic, photoresist, photolithography process.
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